Solder bumping methods for flip chip packaging
A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of...
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Format: | Tagungsbericht |
Sprache: | eng |
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Zusammenfassung: | A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided. |
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ISSN: | 0569-5503 2377-5726 |
DOI: | 10.1109/ECTC.1997.606176 |