Solder bumping methods for flip chip packaging

A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: Rinne, G.A.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.
ISSN:0569-5503
2377-5726
DOI:10.1109/ECTC.1997.606176