Solder bumping methods for flip chip packaging

Solder bumping methods for flip chip packaging

A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of...

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1. Verfasser: Rinne, G.A.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Costs
Electronics packaging
Flip chip
Integrated circuit interconnections
Integrated circuit packaging
Integrated circuit technology
Manufacturing industries
Resists
Solids
Wafer scale integration
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description A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.
doi_str_mv 10.1109/ECTC.1997.606176
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ispartof 1997 Proceedings 47th Electronic Components and Technology Conference, 1997, p.240-247
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2377-5726
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subjects Costs
Electronics packaging
Flip chip
Integrated circuit interconnections
Integrated circuit packaging
Integrated circuit technology
Manufacturing industries
Resists
Solids
Wafer scale integration
title Solder bumping methods for flip chip packaging
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