Solder bumping methods for flip chip packaging

A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Rinne, G.A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Costs Electronics packaging Flip chip Integrated circuit interconnections Integrated circuit packaging Integrated circuit technology Manufacturing industries Resists Solids Wafer scale integration
Online-Zugang:	Volltext bestellen
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