Resin-sealing device and resin-sealing method

The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semicondu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MORI, HIROHARU, TAKAHASHI, HIROSHI, OHTANI, YOSHIKAZU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semiconductor element is mounted; a second molding mold including a cavity into which uncured resin is supplied, the cavity facing a mounting surface of the workpiece, being held on the holding surface of the first molding mold, on which the semiconductor element is mounted; a openable and closable depressurization chamber formed between the first molding mold and the second molding mold; a drive unit which causes one or both of the first molding mold and the second molding mold to move relatively closer to one another in the opposing direction of the first molding mold and the second molding mold so as to form the depressurization chamber; a pressure adjustment unit which performs an internal pressure adjustment from atmos