Resin-sealing device and resin-sealing method
The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semicondu...
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| creator | MORI, HIROHARU TAKAHASHI, HIROSHI OHTANI, YOSHIKAZU |
| description | The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semiconductor element is mounted; a second molding mold including a cavity into which uncured resin is supplied, the cavity facing a mounting surface of the workpiece, being held on the holding surface of the first molding mold, on which the semiconductor element is mounted; a openable and closable depressurization chamber formed between the first molding mold and the second molding mold; a drive unit which causes one or both of the first molding mold and the second molding mold to move relatively closer to one another in the opposing direction of the first molding mold and the second molding mold so as to form the depressurization chamber; a pressure adjustment unit which performs an internal pressure adjustment from atmos |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW201818482A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW201818482A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW201818482A3</originalsourceid><addsrcrecordid>eNrjZNANSi3OzNMtTk3MycxLV0hJLctMTlVIzEtRKEKRyE0tychP4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgaGFoYWJhZGjsbEqAEAuB4qMg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Resin-sealing device and resin-sealing method</title><source>esp@cenet</source><creator>MORI, HIROHARU ; TAKAHASHI, HIROSHI ; OHTANI, YOSHIKAZU</creator><creatorcontrib>MORI, HIROHARU ; TAKAHASHI, HIROSHI ; OHTANI, YOSHIKAZU</creatorcontrib><description>The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semiconductor element is mounted; a second molding mold including a cavity into which uncured resin is supplied, the cavity facing a mounting surface of the workpiece, being held on the holding surface of the first molding mold, on which the semiconductor element is mounted; a openable and closable depressurization chamber formed between the first molding mold and the second molding mold; a drive unit which causes one or both of the first molding mold and the second molding mold to move relatively closer to one another in the opposing direction of the first molding mold and the second molding mold so as to form the depressurization chamber; a pressure adjustment unit which performs an internal pressure adjustment from atmos</description><language>chi ; eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180516&DB=EPODOC&CC=TW&NR=201818482A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180516&DB=EPODOC&CC=TW&NR=201818482A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORI, HIROHARU</creatorcontrib><creatorcontrib>TAKAHASHI, HIROSHI</creatorcontrib><creatorcontrib>OHTANI, YOSHIKAZU</creatorcontrib><title>Resin-sealing device and resin-sealing method</title><description>The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semiconductor element is mounted; a second molding mold including a cavity into which uncured resin is supplied, the cavity facing a mounting surface of the workpiece, being held on the holding surface of the first molding mold, on which the semiconductor element is mounted; a openable and closable depressurization chamber formed between the first molding mold and the second molding mold; a drive unit which causes one or both of the first molding mold and the second molding mold to move relatively closer to one another in the opposing direction of the first molding mold and the second molding mold so as to form the depressurization chamber; a pressure adjustment unit which performs an internal pressure adjustment from atmos</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANSi3OzNMtTk3MycxLV0hJLctMTlVIzEtRKEKRyE0tychP4WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8SHhRgaGFoYWJhZGjsbEqAEAuB4qMg</recordid><startdate>20180516</startdate><enddate>20180516</enddate><creator>MORI, HIROHARU</creator><creator>TAKAHASHI, HIROSHI</creator><creator>OHTANI, YOSHIKAZU</creator><scope>EVB</scope></search><sort><creationdate>20180516</creationdate><title>Resin-sealing device and resin-sealing method</title><author>MORI, HIROHARU ; TAKAHASHI, HIROSHI ; OHTANI, YOSHIKAZU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW201818482A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2018</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>MORI, HIROHARU</creatorcontrib><creatorcontrib>TAKAHASHI, HIROSHI</creatorcontrib><creatorcontrib>OHTANI, YOSHIKAZU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORI, HIROHARU</au><au>TAKAHASHI, HIROSHI</au><au>OHTANI, YOSHIKAZU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resin-sealing device and resin-sealing method</title><date>2018-05-16</date><risdate>2018</risdate><abstract>The purpose of the present invention is to resin-seal a workpiece while the workpiece is being adhesively held securely in a high-vacuum state of not more than about 100 Pa. A resin-sealing device is provided with: a first molding mold including a holding surface for a workpiece on which a semiconductor element is mounted; a second molding mold including a cavity into which uncured resin is supplied, the cavity facing a mounting surface of the workpiece, being held on the holding surface of the first molding mold, on which the semiconductor element is mounted; a openable and closable depressurization chamber formed between the first molding mold and the second molding mold; a drive unit which causes one or both of the first molding mold and the second molding mold to move relatively closer to one another in the opposing direction of the first molding mold and the second molding mold so as to form the depressurization chamber; a pressure adjustment unit which performs an internal pressure adjustment from atmos</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | Resin-sealing device and resin-sealing method |
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