Semiconductor material treatment in cavitating liquid bath

A semiconductor material treatment process employs a liquid bath in which cavitation is induced preferably by a submerged nozzle which directs a liquid jet against the semiconductor material. Preferably, the liquid is water or an aqueous cleaning or etching medium and the semiconductor material is m...

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Hauptverfasser: STEUDTEN, FRIEDRICH, 84489 BURGHAUSEN, DE, SCHANTZ, MATTHAEUS, 84367 REUT, DE, KOEPPL, FRANZ., 84567 ERLBACH, DE
Format: Patent
Sprache:eng ; ger
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Zusammenfassung:A semiconductor material treatment process employs a liquid bath in which cavitation is induced preferably by a submerged nozzle which directs a liquid jet against the semiconductor material. Preferably, the liquid is water or an aqueous cleaning or etching medium and the semiconductor material is monocrystalline or polycrystalline silicon especially in fragment form.