Semiconductor material treatment in cavitating liquid bath

A semiconductor material treatment process employs a liquid bath in which cavitation is induced preferably by a submerged nozzle which directs a liquid jet against the semiconductor material. Preferably, the liquid is water or an aqueous cleaning or etching medium and the semiconductor material is m...

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Hauptverfasser: STEUDTEN, FRIEDRICH, 84489 BURGHAUSEN, DE, SCHANTZ, MATTHAEUS, 84367 REUT, DE, KOEPPL, FRANZ., 84567 ERLBACH, DE
Format: Patent
Sprache:eng ; ger
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