Hybrid Materials: Flexible and Ultrasoft Inorganic 1D Semiconductor and Heterostructure Systems Based on SnIP (Adv. Funct. Mater. 18/2019)

In article number 1900233, Gregor Kieslich, Karthik Shankar, Tom Nilges, and co‐workers, prepare organic and inorganic hybrids, illustrating that SnIP is a candidate to fabricate flexible 1D composites for energy conversion and water splitting applications. SnIP@C3N4 hybrid forms an unusual soft mat...

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Veröffentlicht in:Advanced functional materials 2019-05, Vol.29 (18), p.n/a
Hauptverfasser: Ott, Claudia, Reiter, Felix, Baumgartner, Maximilian, Pielmeier, Markus, Vogel, Anna, Walke, Patrick, Burger, Stefan, Ehrenreich, Michael, Kieslich, Gregor, Daisenberger, Dominik, Armstrong, Jeff, Thakur, Ujwal Kumar, Kumar, Pawan, Chen, Shunda, Donadio, Davide, Walter, Lisa S., Weitz, R. Thomas, Shankar, Karthik, Nilges, Tom
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container_end_page n/a
container_issue 18
container_start_page
container_title Advanced functional materials
container_volume 29
creator Ott, Claudia
Reiter, Felix
Baumgartner, Maximilian
Pielmeier, Markus
Vogel, Anna
Walke, Patrick
Burger, Stefan
Ehrenreich, Michael
Kieslich, Gregor
Daisenberger, Dominik
Armstrong, Jeff
Thakur, Ujwal Kumar
Kumar, Pawan
Chen, Shunda
Donadio, Davide
Walter, Lisa S.
Weitz, R. Thomas
Shankar, Karthik
Nilges, Tom
description In article number 1900233, Gregor Kieslich, Karthik Shankar, Tom Nilges, and co‐workers, prepare organic and inorganic hybrids, illustrating that SnIP is a candidate to fabricate flexible 1D composites for energy conversion and water splitting applications. SnIP@C3N4 hybrid forms an unusual soft material core–shell topology with graphenic carbon nitride wrapping around SnIP.
doi_str_mv 10.1002/adfm.201970120
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source Wiley Online Library Journals Frontfile Complete
subjects 1D materials
Carbon nitride
core–shell particles
Energy conversion
Heterostructures
hybrid materials
inorganic double helix semiconductor SnIP
Materials science
Topology
Water splitting
title Hybrid Materials: Flexible and Ultrasoft Inorganic 1D Semiconductor and Heterostructure Systems Based on SnIP (Adv. Funct. Mater. 18/2019)
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