Hybrid Materials: Flexible and Ultrasoft Inorganic 1D Semiconductor and Heterostructure Systems Based on SnIP (Adv. Funct. Mater. 18/2019)

Hybrid Materials: Flexible and Ultrasoft Inorganic 1D Semiconductor and Heterostructure Systems Based on SnIP (Adv. Funct. Mater. 18/2019)

In article number 1900233, Gregor Kieslich, Karthik Shankar, Tom Nilges, and co‐workers, prepare organic and inorganic hybrids, illustrating that SnIP is a candidate to fabricate flexible 1D composites for energy conversion and water splitting applications. SnIP@C3N4 hybrid forms an unusual soft mat...

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Veröffentlicht in:Advanced functional materials 2019-05, Vol.29 (18), p.n/a
Hauptverfasser: Ott, Claudia, Reiter, Felix, Baumgartner, Maximilian, Pielmeier, Markus, Vogel, Anna, Walke, Patrick, Burger, Stefan, Ehrenreich, Michael, Kieslich, Gregor, Daisenberger, Dominik, Armstrong, Jeff, Thakur, Ujwal Kumar, Kumar, Pawan, Chen, Shunda, Donadio, Davide, Walter, Lisa S., Weitz, R. Thomas, Shankar, Karthik, Nilges, Tom
Format: Artikel
Sprache:eng
Schlagworte:
1D materials
Carbon nitride
core–shell particles
Energy conversion
Heterostructures
hybrid materials
inorganic double helix semiconductor SnIP
Materials science
Topology
Water splitting
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Zusammenfassung:In article number 1900233, Gregor Kieslich, Karthik Shankar, Tom Nilges, and co‐workers, prepare organic and inorganic hybrids, illustrating that SnIP is a candidate to fabricate flexible 1D composites for energy conversion and water splitting applications. SnIP@C3N4 hybrid forms an unusual soft material core–shell topology with graphenic carbon nitride wrapping around SnIP.
ISSN:1616-301X
1616-3028
DOI:10.1002/adfm.201970120