ATTACHING PASSIVE COMPONENTS TO A SEMICONDUCTOR DIE

An external component, typically a surface mount passive, is attached to a semiconductor die. In some embodiments the passive is placed directly over exposed pads on the semiconductor die and attached using conductive tape or conductive epoxy. In some embodiments the passive is attached to the semic...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GRAYDON, BHRET, SHU, WILLIAM KUANG-HUE
Format: Patent
Sprache:eng ; fre
Schlagworte:
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