Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components

A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substr...

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Hauptverfasser: KEUSSEYAN ROUPEN LEON, MOBLEY TIM
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substrate. The surface of the glass substrate is coated with at least one redistribution layer of a metal, a metal oxide, an alloy, a polymer, or a combination thereof. The paste material has improved adhesion to the through-holes. The filled through-holes are hermetic and have a low resistivity.