Filling materials and methods of filling through holes for improved adhesion and hermeticity in glass substrates and other electronic components

A method of processing a glass substrate for use in semi-conductor packaging applications. Through holes are created in a glass substrate and subsequently filled with a metallized paste material. The glass substrate is planarized after metallization to clean and flatten a surface of the glass substr...

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Bibliographische Detailangaben
Hauptverfasser:	KEUSSEYAN ROUPEN LEON, MOBLEY TIM
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METALLURGY MINERAL OR SLAG WOOL PRINTED CIRCUITS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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