RFI free picture frame metal stiffener

Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surround...

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Hauptverfasser: Song, Wil Choon, Sir, Jiun Hann, Koh, Boon Ping, Lim, Min Suet, Goh, Eng Huat, Yong, Khang Choong
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creator Song, Wil Choon
Sir, Jiun Hann
Koh, Boon Ping
Lim, Min Suet
Goh, Eng Huat
Yong, Khang Choong
description Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US11658127B2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US11658127B2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US11658127B23</originalsourceid><addsrcrecordid>eNrjZFALcvNUSCtKTVUoyEwuKS1KBXISc1MVclNLEnMUiksy09JS81KLeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYjJQVUl8aLChoZmphaGRuZORMTFqADidJ0I</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RFI free picture frame metal stiffener</title><source>esp@cenet</source><creator>Song, Wil Choon ; Sir, Jiun Hann ; Koh, Boon Ping ; Lim, Min Suet ; Goh, Eng Huat ; Yong, Khang Choong</creator><creatorcontrib>Song, Wil Choon ; Sir, Jiun Hann ; Koh, Boon Ping ; Lim, Min Suet ; Goh, Eng Huat ; Yong, Khang Choong</creatorcontrib><description>Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230523&amp;DB=EPODOC&amp;CC=US&amp;NR=11658127B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230523&amp;DB=EPODOC&amp;CC=US&amp;NR=11658127B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Song, Wil Choon</creatorcontrib><creatorcontrib>Sir, Jiun Hann</creatorcontrib><creatorcontrib>Koh, Boon Ping</creatorcontrib><creatorcontrib>Lim, Min Suet</creatorcontrib><creatorcontrib>Goh, Eng Huat</creatorcontrib><creatorcontrib>Yong, Khang Choong</creatorcontrib><title>RFI free picture frame metal stiffener</title><description>Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFALcvNUSCtKTVUoyEwuKS1KBXISc1MVclNLEnMUiksy09JS81KLeBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYjJQVUl8aLChoZmphaGRuZORMTFqADidJ0I</recordid><startdate>20230523</startdate><enddate>20230523</enddate><creator>Song, Wil Choon</creator><creator>Sir, Jiun Hann</creator><creator>Koh, Boon Ping</creator><creator>Lim, Min Suet</creator><creator>Goh, Eng Huat</creator><creator>Yong, Khang Choong</creator><scope>EVB</scope></search><sort><creationdate>20230523</creationdate><title>RFI free picture frame metal stiffener</title><author>Song, Wil Choon ; Sir, Jiun Hann ; Koh, Boon Ping ; Lim, Min Suet ; Goh, Eng Huat ; Yong, Khang Choong</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US11658127B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Song, Wil Choon</creatorcontrib><creatorcontrib>Sir, Jiun Hann</creatorcontrib><creatorcontrib>Koh, Boon Ping</creatorcontrib><creatorcontrib>Lim, Min Suet</creatorcontrib><creatorcontrib>Goh, Eng Huat</creatorcontrib><creatorcontrib>Yong, Khang Choong</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Song, Wil Choon</au><au>Sir, Jiun Hann</au><au>Koh, Boon Ping</au><au>Lim, Min Suet</au><au>Goh, Eng Huat</au><au>Yong, Khang Choong</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RFI free picture frame metal stiffener</title><date>2023-05-23</date><risdate>2023</risdate><abstract>Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surrounds the package substrate, where the conductive stiffener has a top portion and a plurality of sidewalls, and where the top portion is directly disposed on the package substrate, and the sidewalls are vertically disposed on the substrate. The semiconductor package also includes the substrate that has a plurality of conductive pads, where the conductive pads are conductively coupled to a ground source. The conductive stiffener may conductively couple the package substrate to the conductive pads of the substrate. The top portion may have a cavity that surrounds the die, where the top portion is directly disposed on a plurality of outer edges of the package substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title RFI free picture frame metal stiffener
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-18T04%3A48%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Song,%20Wil%20Choon&rft.date=2023-05-23&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS11658127B2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true