RFI free picture frame metal stiffener

Embodiments include semiconductor packages and method of forming the semiconductor packages. A semiconductor package includes a package substrate on a substrate, a die on the package substrate, and a conductive stiffener over the package substrate and the substrate. The conductive stiffener surround...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Song, Wil Choon, Sir, Jiun Hann, Koh, Boon Ping, Lim, Min Suet, Goh, Eng Huat, Yong, Khang Choong
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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