Thermocompression bonding using plasma gas

Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be locate...

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Bibliographische Detailangaben
Hauptverfasser: Yao, Jimin, Lu, Donglai David, Liff, Shawna M, Kostiew, George S, Mallik, Amrita
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.