Thermocompression bonding using plasma gas
Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be locate...
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| creator | Yao, Jimin Lu, Donglai David Liff, Shawna M Kostiew, George S Mallik, Amrita |
| description | Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding. |
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A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190521&DB=EPODOC&CC=US&NR=10297567B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190521&DB=EPODOC&CC=US&NR=10297567B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Yao, Jimin</creatorcontrib><creatorcontrib>Lu, Donglai David</creatorcontrib><creatorcontrib>Liff, Shawna M</creatorcontrib><creatorcontrib>Kostiew, George S</creatorcontrib><creatorcontrib>Mallik, Amrita</creatorcontrib><title>Thermocompression bonding using plasma gas</title><description>Described herein are devices and techniques for thermocompression bonding. 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Also described are other embodiments for thermocompression bonding.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAKyUgtys1Pzs8tKEotLs7Mz1NIys9LycxLVygtBpEFOYnFuYkK6YnFPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7UkPjTY0MDI0tzUzNzJyJgYNQBuuimw</recordid><startdate>20190521</startdate><enddate>20190521</enddate><creator>Yao, Jimin</creator><creator>Lu, Donglai David</creator><creator>Liff, Shawna M</creator><creator>Kostiew, George S</creator><creator>Mallik, Amrita</creator><scope>EVB</scope></search><sort><creationdate>20190521</creationdate><title>Thermocompression bonding using plasma gas</title><author>Yao, Jimin ; Lu, Donglai David ; Liff, Shawna M ; Kostiew, George S ; Mallik, Amrita</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US10297567B23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>Yao, Jimin</creatorcontrib><creatorcontrib>Lu, Donglai David</creatorcontrib><creatorcontrib>Liff, Shawna M</creatorcontrib><creatorcontrib>Kostiew, George S</creatorcontrib><creatorcontrib>Mallik, Amrita</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yao, Jimin</au><au>Lu, Donglai David</au><au>Liff, Shawna M</au><au>Kostiew, George S</au><au>Mallik, Amrita</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermocompression bonding using plasma gas</title><date>2019-05-21</date><risdate>2019</risdate><abstract>Described herein are devices and techniques for thermocompression bonding. A device can include a housing, a platform, and a plasma jet. The housing can define a chamber. The platform can be located within the chamber and can be proximate a thermocompression chip bonder. The plasma jet can be located proximate the platform. The plasma jet can be movable about the platform. The plasma jet can include a nozzle arranged to direct a plasma gas onto the platform. Also described are other embodiments for thermocompression bonding.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Thermocompression bonding using plasma gas |
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