Beamless ingot slicing

Methods of cutting ingots for solar cell fabrication, as well ingots and grippers there for, are described. In an example, a method of cutting an ingot includes gripping a portion of the ingot directly with a gripper of a cutting apparatus. The ingot is partially cut to form a plurality of wafer por...

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Bibliographische Detailangaben
Hauptverfasser: BOYON, FERNADO, DAWSON, MATTHEW, STONE, CHUCK, LEGASPI, ROY JOSEPH, SUN, SHENG
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:Methods of cutting ingots for solar cell fabrication, as well ingots and grippers there for, are described. In an example, a method of cutting an ingot includes gripping a portion of the ingot directly with a gripper of a cutting apparatus. The ingot is partially cut to form a plurality of wafer portions projecting from an uncut portion of the ingot. The ingot is further cut to separate the plurality of wafer portions from the uncut portion, to provide a plurality of discrete wafers.