Beamless ingot slicing

Beamless ingot slicing

Methods of cutting ingots for solar cell fabrication, as well ingots and grippers there for, are described. In an example, a method of cutting an ingot includes gripping a portion of the ingot directly with a gripper of a cutting apparatus. The ingot is partially cut to form a plurality of wafer por...

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Hauptverfasser: BOYON, FERNADO, DAWSON, MATTHEW, STONE, CHUCK, LEGASPI, ROY JOSEPH, SUN, SHENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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creator BOYON, FERNADO
DAWSON, MATTHEW
STONE, CHUCK
LEGASPI, ROY JOSEPH
SUN, SHENG
description Methods of cutting ingots for solar cell fabrication, as well ingots and grippers there for, are described. In an example, a method of cutting an ingot includes gripping a portion of the ingot directly with a gripper of a cutting apparatus. The ingot is partially cut to form a plurality of wafer portions projecting from an uncut portion of the ingot. The ingot is further cut to separate the plurality of wafer portions from the uncut portion, to provide a plurality of discrete wafers.
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subjects PERFORMING OPERATIONS
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
title Beamless ingot slicing
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