Semiconductor manufacturing apparatus and manufacturing method for semiconductor apparatus

The device is provided with a camera (22), a collet (19), a collet drive unit (20), a punch-up mechanism (21), and a control unit (30), the control unit (30) having: a memory (32) for storing the positions of semiconductor dies (15); a detection program (36) for sequentially detecting the absolute p...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: URAHASHI, AKIRA, OGATA, YOSHIYUKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The device is provided with a camera (22), a collet (19), a collet drive unit (20), a punch-up mechanism (21), and a control unit (30), the control unit (30) having: a memory (32) for storing the positions of semiconductor dies (15); a detection program (36) for sequentially detecting the absolute positions of each semiconductor die (15) in one row; a pick-up program (38) for sequentially picking up each semiconductor die (15) detected; a predicted position calculation and storing program (37) for calculating, based on the detected absolute positions of the semiconductor dies (15) on the one row , predicted absolute positions of the semiconductor dies (15) in the next row and storing the result into the memory (32); and a field-of-view transport program (39) causing the camera field-of-view to move so that each predicted absolute position stored in the memory (32) is sequentially in the center of the camera (22) field-of-view. This configuration effectively minimizes occurrences of semiconductor dies being le