Semiconductor manufacturing apparatus and manufacturing method for semiconductor apparatus

The device is provided with a camera (22), a collet (19), a collet drive unit (20), a punch-up mechanism (21), and a control unit (30), the control unit (30) having: a memory (32) for storing the positions of semiconductor dies (15); a detection program (36) for sequentially detecting the absolute p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: URAHASHI, AKIRA, OGATA, YOSHIYUKI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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