Heat dissipation module

A heat dissipation module including an air-cooling unit and a water-cooling unit is provided. The air-cooling unit includes a fan and a heat pipe. The heat pipe includes an evaporating part and a condensing part. The evaporating part is thermally coupled to a heat source, and the condensing part is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN, TSUNG-TING, LIN, KUANG-HUA, WANG, CHUNIEH, KUO, SHU-HAO, CHEN, WEIIN, HSIEH, CHENG-WEN, LIAO, WEN-NENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A heat dissipation module including an air-cooling unit and a water-cooling unit is provided. The air-cooling unit includes a fan and a heat pipe. The heat pipe includes an evaporating part and a condensing part. The evaporating part is thermally coupled to a heat source, and the condensing part is disposed corresponding to the fan of the air-cooling unit. The water-cooling unit includes a water block thermally coupled to the evaporating part of the heat pipe. The evaporating part of the heat pipe is located between the water block and the heat source.