Heat dissipation module

A heat dissipation module including an air-cooling unit and a water-cooling unit is provided. The air-cooling unit includes a fan and a heat pipe. The heat pipe includes an evaporating part and a condensing part. The evaporating part is thermally coupled to a heat source, and the condensing part is...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN, TSUNG-TING, LIN, KUANG-HUA, WANG, CHUNIEH, KUO, SHU-HAO, CHEN, WEIIN, HSIEH, CHENG-WEN, LIAO, WEN-NENG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CHEN, TSUNG-TING
LIN, KUANG-HUA
WANG, CHUNIEH
KUO, SHU-HAO
CHEN, WEIIN
HSIEH, CHENG-WEN
LIAO, WEN-NENG
description A heat dissipation module including an air-cooling unit and a water-cooling unit is provided. The air-cooling unit includes a fan and a heat pipe. The heat pipe includes an evaporating part and a condensing part. The evaporating part is thermally coupled to a heat source, and the condensing part is disposed corresponding to the fan of the air-cooling unit. The water-cooling unit includes a water block thermally coupled to the evaporating part of the heat pipe. The evaporating part of the heat pipe is located between the water block and the heat source.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_TW202419805A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>TW202419805A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_TW202419805A3</originalsourceid><addsrcrecordid>eNrjZBD3SE0sUUjJLC7OLEgsyczPU8jNTynNSeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRiaGlhYGpo7GxKgBANJ-Ih8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heat dissipation module</title><source>esp@cenet</source><creator>CHEN, TSUNG-TING ; LIN, KUANG-HUA ; WANG, CHUNIEH ; KUO, SHU-HAO ; CHEN, WEIIN ; HSIEH, CHENG-WEN ; LIAO, WEN-NENG</creator><creatorcontrib>CHEN, TSUNG-TING ; LIN, KUANG-HUA ; WANG, CHUNIEH ; KUO, SHU-HAO ; CHEN, WEIIN ; HSIEH, CHENG-WEN ; LIAO, WEN-NENG</creatorcontrib><description>A heat dissipation module including an air-cooling unit and a water-cooling unit is provided. The air-cooling unit includes a fan and a heat pipe. The heat pipe includes an evaporating part and a condensing part. The evaporating part is thermally coupled to a heat source, and the condensing part is disposed corresponding to the fan of the air-cooling unit. The water-cooling unit includes a water block thermally coupled to the evaporating part of the heat pipe. The evaporating part of the heat pipe is located between the water block and the heat source.</description><language>chi ; eng</language><subject>BLASTING ; CALCULATING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PHYSICS ; PRINTED CIRCUITS ; WEAPONS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240516&amp;DB=EPODOC&amp;CC=TW&amp;NR=202419805A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240516&amp;DB=EPODOC&amp;CC=TW&amp;NR=202419805A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN, TSUNG-TING</creatorcontrib><creatorcontrib>LIN, KUANG-HUA</creatorcontrib><creatorcontrib>WANG, CHUNIEH</creatorcontrib><creatorcontrib>KUO, SHU-HAO</creatorcontrib><creatorcontrib>CHEN, WEIIN</creatorcontrib><creatorcontrib>HSIEH, CHENG-WEN</creatorcontrib><creatorcontrib>LIAO, WEN-NENG</creatorcontrib><title>Heat dissipation module</title><description>A heat dissipation module including an air-cooling unit and a water-cooling unit is provided. The air-cooling unit includes a fan and a heat pipe. The heat pipe includes an evaporating part and a condensing part. The evaporating part is thermally coupled to a heat source, and the condensing part is disposed corresponding to the fan of the air-cooling unit. The water-cooling unit includes a water block thermally coupled to the evaporating part of the heat pipe. The evaporating part of the heat pipe is located between the water block and the heat source.</description><subject>BLASTING</subject><subject>CALCULATING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PHYSICS</subject><subject>PRINTED CIRCUITS</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBD3SE0sUUjJLC7OLEgsyczPU8jNTynNSeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfEh4UYGRiaGlhYGpo7GxKgBANJ-Ih8</recordid><startdate>20240516</startdate><enddate>20240516</enddate><creator>CHEN, TSUNG-TING</creator><creator>LIN, KUANG-HUA</creator><creator>WANG, CHUNIEH</creator><creator>KUO, SHU-HAO</creator><creator>CHEN, WEIIN</creator><creator>HSIEH, CHENG-WEN</creator><creator>LIAO, WEN-NENG</creator><scope>EVB</scope></search><sort><creationdate>20240516</creationdate><title>Heat dissipation module</title><author>CHEN, TSUNG-TING ; LIN, KUANG-HUA ; WANG, CHUNIEH ; KUO, SHU-HAO ; CHEN, WEIIN ; HSIEH, CHENG-WEN ; LIAO, WEN-NENG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_TW202419805A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BLASTING</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN, TSUNG-TING</creatorcontrib><creatorcontrib>LIN, KUANG-HUA</creatorcontrib><creatorcontrib>WANG, CHUNIEH</creatorcontrib><creatorcontrib>KUO, SHU-HAO</creatorcontrib><creatorcontrib>CHEN, WEIIN</creatorcontrib><creatorcontrib>HSIEH, CHENG-WEN</creatorcontrib><creatorcontrib>LIAO, WEN-NENG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN, TSUNG-TING</au><au>LIN, KUANG-HUA</au><au>WANG, CHUNIEH</au><au>KUO, SHU-HAO</au><au>CHEN, WEIIN</au><au>HSIEH, CHENG-WEN</au><au>LIAO, WEN-NENG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heat dissipation module</title><date>2024-05-16</date><risdate>2024</risdate><abstract>A heat dissipation module including an air-cooling unit and a water-cooling unit is provided. The air-cooling unit includes a fan and a heat pipe. The heat pipe includes an evaporating part and a condensing part. The evaporating part is thermally coupled to a heat source, and the condensing part is disposed corresponding to the fan of the air-cooling unit. The water-cooling unit includes a water block thermally coupled to the evaporating part of the heat pipe. The evaporating part of the heat pipe is located between the water block and the heat source.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_TW202419805A
source esp@cenet
subjects BLASTING
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PHYSICS
PRINTED CIRCUITS
WEAPONS
title Heat dissipation module
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-15T22%3A00%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN,%20TSUNG-TING&rft.date=2024-05-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ETW202419805A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true