POLYAMIDE RESIN COMPOSITION

FIELD: chemistry.SUBSTANCE: group of inventions relates to a polyamide resin composition, a method for production thereof and a multilayer moulded article used as packaging material. The polyamide resin composition contains a polyamide (X), which includes a diamine link which includes 90 mol % or mo...

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Bibliographische Detailangaben
Hauptverfasser: OTAKI RIODZI, MITADERA DZUN, JAMAMOTO TAKASI, KATO TOMONORI
Format: Patent
Sprache:eng ; rus
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Beschreibung
Zusammenfassung:FIELD: chemistry.SUBSTANCE: group of inventions relates to a polyamide resin composition, a method for production thereof and a multilayer moulded article used as packaging material. The polyamide resin composition contains a polyamide (X), which includes a diamine link which includes 90 mol % or more of a methaxylylene diamine link, and a dicarboxylic acid link, which includes 70 mol % or more of an adipic acid link or a sebacic acid link, and an alkaline compound (A), which is at least one compound selected from carbonates and carboxylates of alkali metals and alkali-earth metals, where the following equations from (1) to (4) are satisfied: 10?([COOH]-[NH])?80 (1); 0.32?P