MOUNTING METHOD FOR IC CHIP
PURPOSE:To enable the mounting of a solder bump type IC chip with excellent operability by a method wherein a pressure electroconductive rubber is put on a wiring substrate, the IC chip is mounted so that a solder boss on a pedestal be aligned with a solder bump, and the pressure electroconductive r...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PURPOSE:To enable the mounting of a solder bump type IC chip with excellent operability by a method wherein a pressure electroconductive rubber is put on a wiring substrate, the IC chip is mounted so that a solder boss on a pedestal be aligned with a solder bump, and the pressure electroconductive rubber is compressed to make a bump element continuous. CONSTITUTION:Conductor wirings and pedestals 6 are provided on an insulating substrate, and a dam 4 for preventing the flow of solder is provided around each pedestal 6. Solder bosses 5 are formed on the pedestals 6 respectively, and thus a wiring substrate 3 is constructed. On the other hand, an IC chip 1 has solder bumps 2. Assembly of these components is performed in such a manner that a pressure electroconductive rubber 7 is put on the wiring substrate 3, the IC chip 1 is mounted so that the center lines of the solder bumps 2 and the receiving solders 5 are aligned with each other, thereafter a pressure metal fitting 8 is put on the chip, and then fastening is made for fixation by fitting screws 9. According to this method, removal of a flux for a burn or the like is dispensed with, since connection can be attained without heating, and also reliability of connection is not impaired, since an Sn-Ni alloy is not produced. |
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