MOUNTING METHOD FOR IC CHIP

PURPOSE:To enable the mounting of a solder bump type IC chip with excellent operability by a method wherein a pressure electroconductive rubber is put on a wiring substrate, the IC chip is mounted so that a solder boss on a pedestal be aligned with a solder bump, and the pressure electroconductive r...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SAIDA MITSUGI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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