THICK FILM FORMATION
PROBLEM TO BE SOLVED: To form a layer on a large size substrate without thickness unevenness due to steps of a hole. SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering t...
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creator | TAKESHIGE SHIYOUJI TERAUCHI NOBUYUKI |
description | PROBLEM TO BE SOLVED: To form a layer on a large size substrate without thickness unevenness due to steps of a hole. SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering the hole with a film 21 or clogging the hole with a pin and a paste is applied to the substrate in such a state. Without unevenness of film thickness, a thick film 13 can be formed on the substrate 11. |
format | Patent |
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SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering the hole with a film 21 or clogging the hole with a pin and a paste is applied to the substrate in such a state. Without unevenness of film thickness, a thick film 13 can be formed on the substrate 11.</description><edition>6</edition><language>eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRICITY ; PERFORMING OPERATIONS ; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>1999</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990622&DB=EPODOC&CC=JP&NR=H11167862A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19990622&DB=EPODOC&CC=JP&NR=H11167862A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKESHIGE SHIYOUJI</creatorcontrib><creatorcontrib>TERAUCHI NOBUYUKI</creatorcontrib><title>THICK FILM FORMATION</title><description>PROBLEM TO BE SOLVED: To form a layer on a large size substrate without thickness unevenness due to steps of a hole. SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering the hole with a film 21 or clogging the hole with a pin and a paste is applied to the substrate in such a state. Without unevenness of film thickness, a thick film 13 can be formed on the substrate 11.</description><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRICITY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1999</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAJ8fB09lZw8_TxVXDzD_J1DPH09-NhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR6GhoZm5hZmRo7GxKgBAHfpHsc</recordid><startdate>19990622</startdate><enddate>19990622</enddate><creator>TAKESHIGE SHIYOUJI</creator><creator>TERAUCHI NOBUYUKI</creator><scope>EVB</scope></search><sort><creationdate>19990622</creationdate><title>THICK FILM FORMATION</title><author>TAKESHIGE SHIYOUJI ; TERAUCHI NOBUYUKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH11167862A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1999</creationdate><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRICITY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKESHIGE SHIYOUJI</creatorcontrib><creatorcontrib>TERAUCHI NOBUYUKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKESHIGE SHIYOUJI</au><au>TERAUCHI NOBUYUKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THICK FILM FORMATION</title><date>1999-06-22</date><risdate>1999</risdate><abstract>PROBLEM TO BE SOLVED: To form a layer on a large size substrate without thickness unevenness due to steps of a hole. SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering the hole with a film 21 or clogging the hole with a pin and a paste is applied to the substrate in such a state. Without unevenness of film thickness, a thick film 13 can be formed on the substrate 11.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | THICK FILM FORMATION |
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