THICK FILM FORMATION

PROBLEM TO BE SOLVED: To form a layer on a large size substrate without thickness unevenness due to steps of a hole. SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering t...

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Hauptverfasser: TAKESHIGE SHIYOUJI, TERAUCHI NOBUYUKI
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creator TAKESHIGE SHIYOUJI
TERAUCHI NOBUYUKI
description PROBLEM TO BE SOLVED: To form a layer on a large size substrate without thickness unevenness due to steps of a hole. SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering the hole with a film 21 or clogging the hole with a pin and a paste is applied to the substrate in such a state. Without unevenness of film thickness, a thick film 13 can be formed on the substrate 11.
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subjects APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
PERFORMING OPERATIONS
PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL
SPRAYING OR ATOMISING IN GENERAL
TRANSPORTING
title THICK FILM FORMATION
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