THICK FILM FORMATION

PROBLEM TO BE SOLVED: To form a layer on a large size substrate without thickness unevenness due to steps of a hole. SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering t...

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Bibliographische Detailangaben
Hauptverfasser:	TAKESHIGE SHIYOUJI, TERAUCHI NOBUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To form a layer on a large size substrate without thickness unevenness due to steps of a hole. SOLUTION: In the case a thick film is formed on a substrate having step parts due to a hole by applying a paste by a die coating method, the stepped parts are eliminated by covering the hole with a film 21 or clogging the hole with a pin and a paste is applied to the substrate in such a state. Without unevenness of film thickness, a thick film 13 can be formed on the substrate 11.