CORRECTION METHOD OF MULTILAYER PRINTED WIRING BOARD

PURPOSE:To provide a correction technique wherein a defective through hole in a multilayer printed wiring board or the like can be corrected simply and with high reliability. CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which...

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Hauptverfasser: TAIKO YOICHI, FUSE YOSHIAKI
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creator TAIKO YOICHI
FUSE YOSHIAKI
description PURPOSE:To provide a correction technique wherein a defective through hole in a multilayer printed wiring board or the like can be corrected simply and with high reliability. CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which have adhered to the wall surface of the through hole h1 are then etched, an inner-layer copper foil exposed on the wall surface is retreated simultaneously, the wall surface of the through hole h1 is coated with an insulating resin, a cylindrical conductor is brought into close contact and fixed via an adhesive, and a corrected through hole is formed. Alternatively, instead of the cylindrical conductor, an electroless plating operation is executed, and a through-hole conductor layer may be formed. After that, as in ordinary cases, a component lead is inserted into the corrected through hole, a soldering operation is performed, and the connection to a wiring-circuit copper foil 3 damaged by the connecting operation of the defective through hole part is restored by using an external interconnection.
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CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which have adhered to the wall surface of the through hole h1 are then etched, an inner-layer copper foil exposed on the wall surface is retreated simultaneously, the wall surface of the through hole h1 is coated with an insulating resin, a cylindrical conductor is brought into close contact and fixed via an adhesive, and a corrected through hole is formed. Alternatively, instead of the cylindrical conductor, an electroless plating operation is executed, and a through-hole conductor layer may be formed. 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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CORRECTION METHOD OF MULTILAYER PRINTED WIRING BOARD
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