CORRECTION METHOD OF MULTILAYER PRINTED WIRING BOARD
PURPOSE:To provide a correction technique wherein a defective through hole in a multilayer printed wiring board or the like can be corrected simply and with high reliability. CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which...
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creator | TAIKO YOICHI FUSE YOSHIAKI |
description | PURPOSE:To provide a correction technique wherein a defective through hole in a multilayer printed wiring board or the like can be corrected simply and with high reliability. CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which have adhered to the wall surface of the through hole h1 are then etched, an inner-layer copper foil exposed on the wall surface is retreated simultaneously, the wall surface of the through hole h1 is coated with an insulating resin, a cylindrical conductor is brought into close contact and fixed via an adhesive, and a corrected through hole is formed. Alternatively, instead of the cylindrical conductor, an electroless plating operation is executed, and a through-hole conductor layer may be formed. After that, as in ordinary cases, a component lead is inserted into the corrected through hole, a soldering operation is performed, and the connection to a wiring-circuit copper foil 3 damaged by the connecting operation of the defective through hole part is restored by using an external interconnection. |
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CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which have adhered to the wall surface of the through hole h1 are then etched, an inner-layer copper foil exposed on the wall surface is retreated simultaneously, the wall surface of the through hole h1 is coated with an insulating resin, a cylindrical conductor is brought into close contact and fixed via an adhesive, and a corrected through hole is formed. Alternatively, instead of the cylindrical conductor, an electroless plating operation is executed, and a through-hole conductor layer may be formed. After that, as in ordinary cases, a component lead is inserted into the corrected through hole, a soldering operation is performed, and the connection to a wiring-circuit copper foil 3 damaged by the connecting operation of the defective through hole part is restored by using an external interconnection.</description><edition>5</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940531&DB=EPODOC&CC=JP&NR=H06152148A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940531&DB=EPODOC&CC=JP&NR=H06152148A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAIKO YOICHI</creatorcontrib><creatorcontrib>FUSE YOSHIAKI</creatorcontrib><title>CORRECTION METHOD OF MULTILAYER PRINTED WIRING BOARD</title><description>PURPOSE:To provide a correction technique wherein a defective through hole in a multilayer printed wiring board or the like can be corrected simply and with high reliability. CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which have adhered to the wall surface of the through hole h1 are then etched, an inner-layer copper foil exposed on the wall surface is retreated simultaneously, the wall surface of the through hole h1 is coated with an insulating resin, a cylindrical conductor is brought into close contact and fixed via an adhesive, and a corrected through hole is formed. Alternatively, instead of the cylindrical conductor, an electroless plating operation is executed, and a through-hole conductor layer may be formed. After that, as in ordinary cases, a component lead is inserted into the corrected through hole, a soldering operation is performed, and the connection to a wiring-circuit copper foil 3 damaged by the connecting operation of the defective through hole part is restored by using an external interconnection.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDBx9g8KcnUO8fT3U_B1DfHwd1Hwd1PwDfUJ8fRxjHQNUggI8vQLcXVRCPcEMtwVnPwdg1x4GFjTEnOKU3mhNDeDoptriLOHbmpBfnxqcUFicmpeakm8V4CHgZmhqZGhiYWjMTFqAN7GJ7c</recordid><startdate>19940531</startdate><enddate>19940531</enddate><creator>TAIKO YOICHI</creator><creator>FUSE YOSHIAKI</creator><scope>EVB</scope></search><sort><creationdate>19940531</creationdate><title>CORRECTION METHOD OF MULTILAYER PRINTED WIRING BOARD</title><author>TAIKO YOICHI ; FUSE YOSHIAKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH06152148A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1994</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAIKO YOICHI</creatorcontrib><creatorcontrib>FUSE YOSHIAKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAIKO YOICHI</au><au>FUSE YOSHIAKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CORRECTION METHOD OF MULTILAYER PRINTED WIRING BOARD</title><date>1994-05-31</date><risdate>1994</risdate><abstract>PURPOSE:To provide a correction technique wherein a defective through hole in a multilayer printed wiring board or the like can be corrected simply and with high reliability. CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which have adhered to the wall surface of the through hole h1 are then etched, an inner-layer copper foil exposed on the wall surface is retreated simultaneously, the wall surface of the through hole h1 is coated with an insulating resin, a cylindrical conductor is brought into close contact and fixed via an adhesive, and a corrected through hole is formed. Alternatively, instead of the cylindrical conductor, an electroless plating operation is executed, and a through-hole conductor layer may be formed. After that, as in ordinary cases, a component lead is inserted into the corrected through hole, a soldering operation is performed, and the connection to a wiring-circuit copper foil 3 damaged by the connecting operation of the defective through hole part is restored by using an external interconnection.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | CORRECTION METHOD OF MULTILAYER PRINTED WIRING BOARD |
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