CORRECTION METHOD OF MULTILAYER PRINTED WIRING BOARD

PURPOSE:To provide a correction technique wherein a defective through hole in a multilayer printed wiring board or the like can be corrected simply and with high reliability. CONSTITUTION:A through hole h1 is bored in a defective through hole part in a board 1 by using a drill 6, copper scraps which have adhered to the wall surface of the through hole h1 are then etched, an inner-layer copper foil exposed on the wall surface is retreated simultaneously, the wall surface of the through hole h1 is coated with an insulating resin, a cylindrical conductor is brought into close contact and fixed via an adhesive, and a corrected through hole is formed. Alternatively, instead of the cylindrical conductor, an electroless plating operation is executed, and a through-hole conductor layer may be formed. After that, as in ordinary cases, a component lead is inserted into the corrected through hole, a soldering operation is performed, and the connection to a wiring-circuit copper foil 3 damaged by the connecting operation of the defective through hole part is restored by using an external interconnection.