SURFACE TREATING APPARATUS

PURPOSE:To apply a centrifugal force together with a pressing force and to strongly hold a semiconductor substrate by a stationary clamp by providing the stationary clamp to be attached to a rotating peripheral ring and having a clamping pin, deviating the substrate from a rotating center, and pushi...

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1. Verfasser: ATSUMI KENJI
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE:To apply a centrifugal force together with a pressing force and to strongly hold a semiconductor substrate by a stationary clamp by providing the stationary clamp to be attached to a rotating peripheral ring and having a clamping pin, deviating the substrate from a rotating center, and pushing it to the pin by a movable clamp to hold it. CONSTITUTION:A surface treating apparatus for scattering and during dropping liquid on a semiconductor substrate 5 by mechanically holding the substrate 5, and rotating it at a high speed, a stationary clamp 1 having a plurality of clamping pins 6 to be attached to one outer periphery of a rotating peripheral ring 2, and a movable clamp 3 for pressing the substrate 5 to the pin 6 are provided, the center C1 of the substrate 5 is deviated from the center C2 of the ring 2 to hold the substrate 5. For example, the substrate 5 is fixed by pressing down a piston 9 against a spring 8 disposed around the shaft of a center plate 4 to rotate the plate 4 along the groove of the piston 9 and simultaneously sliding the clamp 3 to press the substrate 5 to the pin 6.