SURFACE TREATING APPARATUS
PURPOSE:To apply a centrifugal force together with a pressing force and to strongly hold a semiconductor substrate by a stationary clamp by providing the stationary clamp to be attached to a rotating peripheral ring and having a clamping pin, deviating the substrate from a rotating center, and pushi...
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| creator | ATSUMI KENJI |
| description | PURPOSE:To apply a centrifugal force together with a pressing force and to strongly hold a semiconductor substrate by a stationary clamp by providing the stationary clamp to be attached to a rotating peripheral ring and having a clamping pin, deviating the substrate from a rotating center, and pushing it to the pin by a movable clamp to hold it. CONSTITUTION:A surface treating apparatus for scattering and during dropping liquid on a semiconductor substrate 5 by mechanically holding the substrate 5, and rotating it at a high speed, a stationary clamp 1 having a plurality of clamping pins 6 to be attached to one outer periphery of a rotating peripheral ring 2, and a movable clamp 3 for pressing the substrate 5 to the pin 6 are provided, the center C1 of the substrate 5 is deviated from the center C2 of the ring 2 to hold the substrate 5. For example, the substrate 5 is fixed by pressing down a piston 9 against a spring 8 disposed around the shaft of a center plate 4 to rotate the plate 4 along the groove of the piston 9 and simultaneously sliding the clamp 3 to press the substrate 5 to the pin 6. |
| format | Patent |
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CONSTITUTION:A surface treating apparatus for scattering and during dropping liquid on a semiconductor substrate 5 by mechanically holding the substrate 5, and rotating it at a high speed, a stationary clamp 1 having a plurality of clamping pins 6 to be attached to one outer periphery of a rotating peripheral ring 2, and a movable clamp 3 for pressing the substrate 5 to the pin 6 are provided, the center C1 of the substrate 5 is deviated from the center C2 of the ring 2 to hold the substrate 5. For example, the substrate 5 is fixed by pressing down a piston 9 against a spring 8 disposed around the shaft of a center plate 4 to rotate the plate 4 along the groove of the piston 9 and simultaneously sliding the clamp 3 to press the substrate 5 to the pin 6.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DRYING ; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>1990</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901220&DB=EPODOC&CC=JP&NR=H02307220A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19901220&DB=EPODOC&CC=JP&NR=H02307220A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ATSUMI KENJI</creatorcontrib><title>SURFACE TREATING APPARATUS</title><description>PURPOSE:To apply a centrifugal force together with a pressing force and to strongly hold a semiconductor substrate by a stationary clamp by providing the stationary clamp to be attached to a rotating peripheral ring and having a clamping pin, deviating the substrate from a rotating center, and pushing it to the pin by a movable clamp to hold it. CONSTITUTION:A surface treating apparatus for scattering and during dropping liquid on a semiconductor substrate 5 by mechanically holding the substrate 5, and rotating it at a high speed, a stationary clamp 1 having a plurality of clamping pins 6 to be attached to one outer periphery of a rotating peripheral ring 2, and a movable clamp 3 for pressing the substrate 5 to the pin 6 are provided, the center C1 of the substrate 5 is deviated from the center C2 of the ring 2 to hold the substrate 5. For example, the substrate 5 is fixed by pressing down a piston 9 against a spring 8 disposed around the shaft of a center plate 4 to rotate the plate 4 along the groove of the piston 9 and simultaneously sliding the clamp 3 to press the substrate 5 to the pin 6.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DRYING</subject><subject>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1990</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAKDg1yc3R2VQgJcnUM8fRzV3AMCHAMcgwJDeZhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfFeAR4GRsYG5kZGBo7GxKgBAECkIHs</recordid><startdate>19901220</startdate><enddate>19901220</enddate><creator>ATSUMI KENJI</creator><scope>EVB</scope></search><sort><creationdate>19901220</creationdate><title>SURFACE TREATING APPARATUS</title><author>ATSUMI KENJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH02307220A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1990</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DRYING</topic><topic>DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>ATSUMI KENJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ATSUMI KENJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE TREATING APPARATUS</title><date>1990-12-20</date><risdate>1990</risdate><abstract>PURPOSE:To apply a centrifugal force together with a pressing force and to strongly hold a semiconductor substrate by a stationary clamp by providing the stationary clamp to be attached to a rotating peripheral ring and having a clamping pin, deviating the substrate from a rotating center, and pushing it to the pin by a movable clamp to hold it. CONSTITUTION:A surface treating apparatus for scattering and during dropping liquid on a semiconductor substrate 5 by mechanically holding the substrate 5, and rotating it at a high speed, a stationary clamp 1 having a plurality of clamping pins 6 to be attached to one outer periphery of a rotating peripheral ring 2, and a movable clamp 3 for pressing the substrate 5 to the pin 6 are provided, the center C1 of the substrate 5 is deviated from the center C2 of the ring 2 to hold the substrate 5. For example, the substrate 5 is fixed by pressing down a piston 9 against a spring 8 disposed around the shaft of a center plate 4 to rotate the plate 4 along the groove of the piston 9 and simultaneously sliding the clamp 3 to press the substrate 5 to the pin 6.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS |
| title | SURFACE TREATING APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-21T08%3A52%3A10IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ATSUMI%20KENJI&rft.date=1990-12-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH02307220A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |