POLISHING SLURRY COMPOSITION

To provide a polishing slurry composition including colloidal silica abrasive particles that may improve a surface planarization process of a thin film applied to a semiconductor device and a display device.SOLUTION: A polishing slurry composition comprises: colloidal silica abrasive particles; a me...

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Hauptverfasser: HWANG JINSOOK, LEE SANGMI, SHIN NARA, KONG HYUNGOO, HWANG INSEOL
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creator HWANG JINSOOK
LEE SANGMI
SHIN NARA
KONG HYUNGOO
HWANG INSEOL
description To provide a polishing slurry composition including colloidal silica abrasive particles that may improve a surface planarization process of a thin film applied to a semiconductor device and a display device.SOLUTION: A polishing slurry composition comprises: colloidal silica abrasive particles; a metal oxide monomolecular complexing agent; an oxidizer; and a pH adjusting agent and/or a water-soluble polymer. The colloidal silica abrasive particles are included in the slurry composition in an amount from 0.0001 pts.wt. to 20 pts.wt.SELECTED DRAWING: Figure 1 【課題】半導体素子及びディスプレイ素子に適用される薄膜の表面平坦化工程を改善させ得る、コロイダルシリカの研磨粒子を含む研磨用スラリー組成物の提供。【解決手段】コロイダルシリカの研磨粒子と、金属酸化物単分子錯化剤と、酸化剤と、pH調整剤、水溶性ポリマー又はこの2つとを含む、研磨用スラリー組成物。コロイダルシリカの研磨粒子は、スラリー組成物に対して0.0001重量部ないし20重量部で含まれる、研磨用スラリー組成物。【選択図】図1
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The colloidal silica abrasive particles are included in the slurry composition in an amount from 0.0001 pts.wt. to 20 pts.wt.SELECTED DRAWING: Figure 1 【課題】半導体素子及びディスプレイ素子に適用される薄膜の表面平坦化工程を改善させ得る、コロイダルシリカの研磨粒子を含む研磨用スラリー組成物の提供。【解決手段】コロイダルシリカの研磨粒子と、金属酸化物単分子錯化剤と、酸化剤と、pH調整剤、水溶性ポリマー又はこの2つとを含む、研磨用スラリー組成物。コロイダルシリカの研磨粒子は、スラリー組成物に対して0.0001重量部ないし20重量部で含まれる、研磨用スラリー組成物。【選択図】図1</description><language>eng ; jpn</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; POLISHING ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; SEMICONDUCTOR DEVICES ; SKI WAXES ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200109&amp;DB=EPODOC&amp;CC=JP&amp;NR=2020002356A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200109&amp;DB=EPODOC&amp;CC=JP&amp;NR=2020002356A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HWANG JINSOOK</creatorcontrib><creatorcontrib>LEE SANGMI</creatorcontrib><creatorcontrib>SHIN NARA</creatorcontrib><creatorcontrib>KONG HYUNGOO</creatorcontrib><creatorcontrib>HWANG INSEOL</creatorcontrib><title>POLISHING SLURRY COMPOSITION</title><description>To provide a polishing slurry composition including colloidal silica abrasive particles that may improve a surface planarization process of a thin film applied to a semiconductor device and a display device.SOLUTION: A polishing slurry composition comprises: colloidal silica abrasive particles; a metal oxide monomolecular complexing agent; an oxidizer; and a pH adjusting agent and/or a water-soluble polymer. 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subjects ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SEMICONDUCTOR DEVICES
SKI WAXES
TRANSPORTING
title POLISHING SLURRY COMPOSITION
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