ELECTRONIC CONTROLLER, AND ATTACHMENT METHOD THEREOF AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide an electronic controller capable of simplifying the manufacture thereof, and to provide an attachment method thereof and a method of manufacturing the same.SOLUTION: In an electronic controller including a heat sink 3, an electronic component 5 is mounted on the lowe...

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Bibliographische Detailangaben
Hauptverfasser: YAMA HAJIME, HORIKIRI KOJI
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an electronic controller capable of simplifying the manufacture thereof, and to provide an attachment method thereof and a method of manufacturing the same.SOLUTION: In an electronic controller including a heat sink 3, an electronic component 5 is mounted on the lower surface 2a of a circuit board 2 facing the bottom wall 6 of a bottomed case 1, the heat absorption plate 3a of the heat sink 3 is in contact with the upper surface 2b of the circuit board 2, a heat dissipation fin 3b is projecting upward from the heat absorption plate 3a, the circuit board 2 and electronic component 5 are embedded in a potting material 8 filling the bottomed case 1, along with the heat absorption plate 3a of the heat sink 3 and the base 3c of the heat dissipation fin 3b, the tip 3d of the heat dissipation fin 3b is projected from the upper surface of the potting material 8, and exposed from the case inlet 4 toward the outside of the bottomed case 1.SELECTED DRAWING: Figure 1 【課題】電子制御装置の製造を簡素化できる電子制御装置、並びにその取り付け方法とその製造方法を提供する。【解決手段】ヒートシンク3を備え、有底ケース1の底壁6に対向する回路基板2の下面2aに電子部品5が実装され、回路基板2の上面2bにヒートシンク3の吸熱板3aが接し、吸熱板3aから上向きに放熱フィン3bが突出され、回路基板2と電子部品5とが、ヒートシンク3の吸熱板3aや放熱フィン3bの基部3cとともに、有底ケース1内に充填されたポッティング材8に埋設され、放熱フィン3bの先端部3dがポッティング材8の上面から突出され、ケース入口4から有底ケース1外に向けて露出されている。【選択図】 図1