ELECTRONIC CONTROLLER, AND ATTACHMENT METHOD THEREOF AND METHOD OF MANUFACTURING THE SAME
PROBLEM TO BE SOLVED: To provide an electronic controller capable of simplifying the manufacture thereof, and to provide an attachment method thereof and a method of manufacturing the same.SOLUTION: In an electronic controller including a heat sink 3, an electronic component 5 is mounted on the lowe...
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| creator | YAMA HAJIME HORIKIRI KOJI |
| description | PROBLEM TO BE SOLVED: To provide an electronic controller capable of simplifying the manufacture thereof, and to provide an attachment method thereof and a method of manufacturing the same.SOLUTION: In an electronic controller including a heat sink 3, an electronic component 5 is mounted on the lower surface 2a of a circuit board 2 facing the bottom wall 6 of a bottomed case 1, the heat absorption plate 3a of the heat sink 3 is in contact with the upper surface 2b of the circuit board 2, a heat dissipation fin 3b is projecting upward from the heat absorption plate 3a, the circuit board 2 and electronic component 5 are embedded in a potting material 8 filling the bottomed case 1, along with the heat absorption plate 3a of the heat sink 3 and the base 3c of the heat dissipation fin 3b, the tip 3d of the heat dissipation fin 3b is projected from the upper surface of the potting material 8, and exposed from the case inlet 4 toward the outside of the bottomed case 1.SELECTED DRAWING: Figure 1
【課題】電子制御装置の製造を簡素化できる電子制御装置、並びにその取り付け方法とその製造方法を提供する。【解決手段】ヒートシンク３を備え、有底ケース１の底壁６に対向する回路基板２の下面２ａに電子部品５が実装され、回路基板２の上面２ｂにヒートシンク３の吸熱板３ａが接し、吸熱板３ａから上向きに放熱フィン３ｂが突出され、回路基板２と電子部品５とが、ヒートシンク３の吸熱板３ａや放熱フィン３ｂの基部３ｃとともに、有底ケース１内に充填されたポッティング材８に埋設され、放熱フィン３ｂの先端部３ｄがポッティング材８の上面から突出され、ケース入口４から有底ケース１外に向けて露出されている。【選択図】 図１ |
| format | Patent |
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【課題】電子制御装置の製造を簡素化できる電子制御装置、並びにその取り付け方法とその製造方法を提供する。【解決手段】ヒートシンク３を備え、有底ケース１の底壁６に対向する回路基板２の下面２ａに電子部品５が実装され、回路基板２の上面２ｂにヒートシンク３の吸熱板３ａが接し、吸熱板３ａから上向きに放熱フィン３ｂが突出され、回路基板２と電子部品５とが、ヒートシンク３の吸熱板３ａや放熱フィン３ｂの基部３ｃとともに、有底ケース１内に充填されたポッティング材８に埋設され、放熱フィン３ｂの先端部３ｄがポッティング材８の上面から突出され、ケース入口４から有底ケース１外に向けて露出されている。【選択図】 図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; VEHICLES IN GENERAL ; VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160509&DB=EPODOC&CC=JP&NR=2016072329A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160509&DB=EPODOC&CC=JP&NR=2016072329A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMA HAJIME</creatorcontrib><creatorcontrib>HORIKIRI KOJI</creatorcontrib><title>ELECTRONIC CONTROLLER, AND ATTACHMENT METHOD THEREOF AND METHOD OF MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide an electronic controller capable of simplifying the manufacture thereof, and to provide an attachment method thereof and a method of manufacturing the same.SOLUTION: In an electronic controller including a heat sink 3, an electronic component 5 is mounted on the lower surface 2a of a circuit board 2 facing the bottom wall 6 of a bottomed case 1, the heat absorption plate 3a of the heat sink 3 is in contact with the upper surface 2b of the circuit board 2, a heat dissipation fin 3b is projecting upward from the heat absorption plate 3a, the circuit board 2 and electronic component 5 are embedded in a potting material 8 filling the bottomed case 1, along with the heat absorption plate 3a of the heat sink 3 and the base 3c of the heat dissipation fin 3b, the tip 3d of the heat dissipation fin 3b is projected from the upper surface of the potting material 8, and exposed from the case inlet 4 toward the outside of the bottomed case 1.SELECTED DRAWING: Figure 1
【課題】電子制御装置の製造を簡素化できる電子制御装置、並びにその取り付け方法とその製造方法を提供する。【解決手段】ヒートシンク３を備え、有底ケース１の底壁６に対向する回路基板２の下面２ａに電子部品５が実装され、回路基板２の上面２ｂにヒートシンク３の吸熱板３ａが接し、吸熱板３ａから上向きに放熱フィン３ｂが突出され、回路基板２と電子部品５とが、ヒートシンク３の吸熱板３ａや放熱フィン３ｂの基部３ｃとともに、有底ケース１内に充填されたポッティング材８に埋設され、放熱フィン３ｂの先端部３ｄがポッティング材８の上面から突出され、ケース入口４から有底ケース１外に向けて露出されている。【選択図】 図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>VEHICLES IN GENERAL</subject><subject>VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZIh09XF1Dgny9_N0VnD29wOyfHxcg3QUHP1cFBxDQhydPXxd_UIUfF1DPPxdFEI8XINc_d3AslAhIM_X0S_UzdE5JDTI088dpEYh2NHXlYeBNS0xpziVF0pzMyi5uYY4e-imFuTHpxYXJCan5qWWxHsFGBkYmhmYGxkbWToaE6UIAG1XMbo</recordid><startdate>20160509</startdate><enddate>20160509</enddate><creator>YAMA HAJIME</creator><creator>HORIKIRI KOJI</creator><scope>EVB</scope></search><sort><creationdate>20160509</creationdate><title>ELECTRONIC CONTROLLER, AND ATTACHMENT METHOD THEREOF AND METHOD OF MANUFACTURING THE SAME</title><author>YAMA HAJIME ; HORIKIRI KOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2016072329A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>VEHICLES IN GENERAL</topic><topic>VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMA HAJIME</creatorcontrib><creatorcontrib>HORIKIRI KOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMA HAJIME</au><au>HORIKIRI KOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC CONTROLLER, AND ATTACHMENT METHOD THEREOF AND METHOD OF MANUFACTURING THE SAME</title><date>2016-05-09</date><risdate>2016</risdate><abstract>PROBLEM TO BE SOLVED: To provide an electronic controller capable of simplifying the manufacture thereof, and to provide an attachment method thereof and a method of manufacturing the same.SOLUTION: In an electronic controller including a heat sink 3, an electronic component 5 is mounted on the lower surface 2a of a circuit board 2 facing the bottom wall 6 of a bottomed case 1, the heat absorption plate 3a of the heat sink 3 is in contact with the upper surface 2b of the circuit board 2, a heat dissipation fin 3b is projecting upward from the heat absorption plate 3a, the circuit board 2 and electronic component 5 are embedded in a potting material 8 filling the bottomed case 1, along with the heat absorption plate 3a of the heat sink 3 and the base 3c of the heat dissipation fin 3b, the tip 3d of the heat dissipation fin 3b is projected from the upper surface of the potting material 8, and exposed from the case inlet 4 toward the outside of the bottomed case 1.SELECTED DRAWING: Figure 1
【課題】電子制御装置の製造を簡素化できる電子制御装置、並びにその取り付け方法とその製造方法を提供する。【解決手段】ヒートシンク３を備え、有底ケース１の底壁６に対向する回路基板２の下面２ａに電子部品５が実装され、回路基板２の上面２ｂにヒートシンク３の吸熱板３ａが接し、吸熱板３ａから上向きに放熱フィン３ｂが突出され、回路基板２と電子部品５とが、ヒートシンク３の吸熱板３ａや放熱フィン３ｂの基部３ｃとともに、有底ケース１内に充填されたポッティング材８に埋設され、放熱フィン３ｂの先端部３ｄがポッティング材８の上面から突出され、ケース入口４から有底ケース１外に向けて露出されている。【選択図】 図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING VEHICLES IN GENERAL VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISEPROVIDED FOR |
| title | ELECTRONIC CONTROLLER, AND ATTACHMENT METHOD THEREOF AND METHOD OF MANUFACTURING THE SAME |
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