USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS

Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same.

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Bibliographische Detailangaben
Hauptverfasser: ADAMCZYK, Andrew, J, VRTIS, Raymond Nicholas, ENTLEY, William Robert, THEODOROU, Kathleen Esther, ACHTYL, Jennifer Lynn Anne, RIDGEWAY, Robert Gordon, SINATORE, Dino
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same.