USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same.
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. |
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