USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same.
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| creator | ADAMCZYK, Andrew, J VRTIS, Raymond Nicholas ENTLEY, William Robert THEODOROU, Kathleen Esther ACHTYL, Jennifer Lynn Anne RIDGEWAY, Robert Gordon SINATORE, Dino |
| description | Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | USE OF SILYL BRIDGED ALKYL COMPOUNDS FOR DENSE OSG FILMS |
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