ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS

Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishi...

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Bibliographische Detailangaben
Hauptverfasser: FUNG, Jason G, JAWALI, Puneet Narendra, WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka, BARADANAHALLI KENCHAPPA, Nandan, MANZONIE, Adam Wade, LAWING, Andrew Scott, BAJAJ, Rajeev
Format: Patent
Sprache:eng ; fre ; ger
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