ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS
Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishi...
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| creator | FUNG, Jason G JAWALI, Puneet Narendra WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka BARADANAHALLI KENCHAPPA, Nandan MANZONIE, Adam Wade LAWING, Andrew Scott BAJAJ, Rajeev |
| description | Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions. |
| format | Patent |
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In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241211&DB=EPODOC&CC=EP&NR=4168210A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241211&DB=EPODOC&CC=EP&NR=4168210A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>FUNG, Jason G</creatorcontrib><creatorcontrib>JAWALI, Puneet Narendra</creatorcontrib><creatorcontrib>WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka</creatorcontrib><creatorcontrib>BARADANAHALLI KENCHAPPA, Nandan</creatorcontrib><creatorcontrib>MANZONIE, Adam Wade</creatorcontrib><creatorcontrib>LAWING, Andrew Scott</creatorcontrib><creatorcontrib>BAJAJ, Rajeev</creatorcontrib><title>ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS</title><description>Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHB3dAlz9HN2dVEI8PfxDPbw9HNXCHB0CVZw9HNRCHL1cQxBl1LwdfQLdXN0DgkNAon4uoZ4-LsE8zCwpiXmFKfyQmluBgU31xBnD93Ugvz41OKCxOTUvNSSeNcAE0MzCyNDA0cTYyKUAABxkiwR</recordid><startdate>20241211</startdate><enddate>20241211</enddate><creator>FUNG, Jason G</creator><creator>JAWALI, Puneet Narendra</creator><creator>WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka</creator><creator>BARADANAHALLI KENCHAPPA, Nandan</creator><creator>MANZONIE, Adam Wade</creator><creator>LAWING, Andrew Scott</creator><creator>BAJAJ, Rajeev</creator><scope>EVB</scope></search><sort><creationdate>20241211</creationdate><title>ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS</title><author>FUNG, Jason G ; JAWALI, Puneet Narendra ; WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka ; BARADANAHALLI KENCHAPPA, Nandan ; MANZONIE, Adam Wade ; LAWING, Andrew Scott ; BAJAJ, Rajeev</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4168210A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>FUNG, Jason G</creatorcontrib><creatorcontrib>JAWALI, Puneet Narendra</creatorcontrib><creatorcontrib>WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka</creatorcontrib><creatorcontrib>BARADANAHALLI KENCHAPPA, Nandan</creatorcontrib><creatorcontrib>MANZONIE, Adam Wade</creatorcontrib><creatorcontrib>LAWING, Andrew Scott</creatorcontrib><creatorcontrib>BAJAJ, Rajeev</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>FUNG, Jason G</au><au>JAWALI, Puneet Narendra</au><au>WEWALA GONNAGAHADENIYAGE, Shiyan Akalanka</au><au>BARADANAHALLI KENCHAPPA, Nandan</au><au>MANZONIE, Adam Wade</au><au>LAWING, Andrew Scott</au><au>BAJAJ, Rajeev</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS</title><date>2024-12-11</date><risdate>2024</risdate><abstract>Embodiments herein generally relate to polishing pads and method of forming polishing pads. In one embodiment, a polishing pad having a polishing surface that is configured to polish a surface of a substrate is provided. The polishing pad includes a polishing layer. At least a portion of the polishing layer comprises a continuous phase of polishing material featuring a plurality of first regions having a first pore-feature density and a plurality of second regions having a second pore-feature density that is different from the first pore-feature density. The plurality of first regions are distributed in a pattern in an X-Y plane of the polishing pad in a side-by-side arrangement with the plurality of second regions and individual portions or ones of the plurality of first regions are interposed between individual portions or ones of the plurality of second regions.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | ADVANCED POLISHING PADS AND RELATED POLISHING PAD MANUFACTURING METHODS |
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