Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices
The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconducto...
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creator | CHOI, JUN-HEE SOHN, JIN-SEUNG CHO, EUN-HYOUNG MOON, CHANG-YOUL |
description | The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200). |
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The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160928&DB=EPODOC&CC=EP&NR=2772948A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160928&DB=EPODOC&CC=EP&NR=2772948A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI, JUN-HEE</creatorcontrib><creatorcontrib>SOHN, JIN-SEUNG</creatorcontrib><creatorcontrib>CHO, EUN-HYOUNG</creatorcontrib><creatorcontrib>MOON, CHANG-YOUL</creatorcontrib><title>Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices</title><description>The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). 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The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200).</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices |
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