Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices

The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconducto...

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Hauptverfasser: CHOI, JUN-HEE, SOHN, JIN-SEUNG, CHO, EUN-HYOUNG, MOON, CHANG-YOUL
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Sprache:eng ; fre ; ger
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creator CHOI, JUN-HEE
SOHN, JIN-SEUNG
CHO, EUN-HYOUNG
MOON, CHANG-YOUL
description The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200).
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2772948A3</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2772948A3</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2772948A33</originalsourceid><addsrcrecordid>eNqNy7sKAjEUhOE0FqK-Q17AZldYLUVWbAQL--V4MtFAcrLkIj6-olZWVlP830wVH1Fu0Wgbky6JJFuk5OSqM4LjKKZyeSV4BEjJmuRjA0m1xKW-sfV4uIvHz8vg7hh5riaWfMbiuzOl9_15d1hijAPySAxBGfpT03XNZrXetu0f5AnLbD94</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices</title><source>esp@cenet</source><creator>CHOI, JUN-HEE ; SOHN, JIN-SEUNG ; CHO, EUN-HYOUNG ; MOON, CHANG-YOUL</creator><creatorcontrib>CHOI, JUN-HEE ; SOHN, JIN-SEUNG ; CHO, EUN-HYOUNG ; MOON, CHANG-YOUL</creatorcontrib><description>The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160928&amp;DB=EPODOC&amp;CC=EP&amp;NR=2772948A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20160928&amp;DB=EPODOC&amp;CC=EP&amp;NR=2772948A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOI, JUN-HEE</creatorcontrib><creatorcontrib>SOHN, JIN-SEUNG</creatorcontrib><creatorcontrib>CHO, EUN-HYOUNG</creatorcontrib><creatorcontrib>MOON, CHANG-YOUL</creatorcontrib><title>Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices</title><description>The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy7sKAjEUhOE0FqK-Q17AZldYLUVWbAQL--V4MtFAcrLkIj6-olZWVlP830wVH1Fu0Wgbky6JJFuk5OSqM4LjKKZyeSV4BEjJmuRjA0m1xKW-sfV4uIvHz8vg7hh5riaWfMbiuzOl9_15d1hijAPySAxBGfpT03XNZrXetu0f5AnLbD94</recordid><startdate>20160928</startdate><enddate>20160928</enddate><creator>CHOI, JUN-HEE</creator><creator>SOHN, JIN-SEUNG</creator><creator>CHO, EUN-HYOUNG</creator><creator>MOON, CHANG-YOUL</creator><scope>EVB</scope></search><sort><creationdate>20160928</creationdate><title>Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices</title><author>CHOI, JUN-HEE ; SOHN, JIN-SEUNG ; CHO, EUN-HYOUNG ; MOON, CHANG-YOUL</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2772948A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOI, JUN-HEE</creatorcontrib><creatorcontrib>SOHN, JIN-SEUNG</creatorcontrib><creatorcontrib>CHO, EUN-HYOUNG</creatorcontrib><creatorcontrib>MOON, CHANG-YOUL</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOI, JUN-HEE</au><au>SOHN, JIN-SEUNG</au><au>CHO, EUN-HYOUNG</au><au>MOON, CHANG-YOUL</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices</title><date>2016-09-28</date><risdate>2016</risdate><abstract>The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200).</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-20T04%3A43%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHOI,%20JUN-HEE&rft.date=2016-09-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2772948A3%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true