Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices

Method for transferring semiconductor elements and for manufacturing flexible semiconductor devices

The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconducto...

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Bibliographische Detailangaben
Hauptverfasser: CHOI, JUN-HEE, SOHN, JIN-SEUNG, CHO, EUN-HYOUNG, MOON, CHANG-YOUL
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present disclosure relates to a method of transferring semiconductor elements (200) from a non-flexible substrate (100) to a flexible substrate (450). The present disclosure also relates to a method of manufacturing a flexible semiconductor device based on the method of transferring semiconductor elements. The semiconductor elements (200) grown or formed on a non-flexible substrate (100) may be effectively transferred to a resin layer (450) while maintaining an arrangement of the semiconductor elements. The resin layer may function as a flexible substrate for supporting the vertical semiconductor elements (200).