Curable silicone composition
Provided is a curable silicone composition which is capable of providing a cured product having low RI and high hardness and which can be cured at a low temperature in a short period of time. The curable silicone composition according to the present invention comprises: (A-1) a resinous organopolysi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | Provided is a curable silicone composition which is capable of providing a cured product having low RI and high hardness and which can be cured at a low temperature in a short period of time. The curable silicone composition according to the present invention comprises: (A-1) a resinous organopolysiloxane having an aryl group content of less than 0-10 mol% and having two or more alkenyl groups bonded to Si; (B-1) a resinous organohydrogenpolysiloxane having an aryl group content of 10 mol% or more and having two or more H bonds to Si; and (C) a hydrosilylation reaction catalyst, the amount of (A-2) a linear organopolysiloxane having two or more alkenyl groups bonded to Si in the composition being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition, and the amount of (A-3) a linear organopolysiloxane having two or more alkenyl groups bonded to Si being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition. (the total number of moles of H |
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