Curable silicone composition
Provided is a curable silicone composition which is capable of providing a cured product having low RI and high hardness and which can be cured at a low temperature in a short period of time. The curable silicone composition according to the present invention comprises: (A-1) a resinous organopolysi...
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| creator | OTSUKA RIKUTO YAMAGUCHI SOSUKE TAKEUCHI JUNYA |
| description | Provided is a curable silicone composition which is capable of providing a cured product having low RI and high hardness and which can be cured at a low temperature in a short period of time. The curable silicone composition according to the present invention comprises: (A-1) a resinous organopolysiloxane having an aryl group content of less than 0-10 mol% and having two or more alkenyl groups bonded to Si; (B-1) a resinous organohydrogenpolysiloxane having an aryl group content of 10 mol% or more and having two or more H bonds to Si; and (C) a hydrosilylation reaction catalyst, the amount of (A-2) a linear organopolysiloxane having two or more alkenyl groups bonded to Si in the composition being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition, and the amount of (A-3) a linear organopolysiloxane having two or more alkenyl groups bonded to Si being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition. (the total number of moles of H |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN118256090A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN118256090A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN118256090A3</originalsourceid><addsrcrecordid>eNrjZJBxLi1KTMpJVSjOzMlMzs9LVUjOzy3IL84syczP42FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWRqZmBpYGjsbEqAEAuzMkCw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Curable silicone composition</title><source>esp@cenet</source><creator>OTSUKA RIKUTO ; YAMAGUCHI SOSUKE ; TAKEUCHI JUNYA</creator><creatorcontrib>OTSUKA RIKUTO ; YAMAGUCHI SOSUKE ; TAKEUCHI JUNYA</creatorcontrib><description>Provided is a curable silicone composition which is capable of providing a cured product having low RI and high hardness and which can be cured at a low temperature in a short period of time. The curable silicone composition according to the present invention comprises: (A-1) a resinous organopolysiloxane having an aryl group content of less than 0-10 mol% and having two or more alkenyl groups bonded to Si; (B-1) a resinous organohydrogenpolysiloxane having an aryl group content of 10 mol% or more and having two or more H bonds to Si; and (C) a hydrosilylation reaction catalyst, the amount of (A-2) a linear organopolysiloxane having two or more alkenyl groups bonded to Si in the composition being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition, and the amount of (A-3) a linear organopolysiloxane having two or more alkenyl groups bonded to Si being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition. (the total number of moles of H</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; METALLURGY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PHYSICS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240628&DB=EPODOC&CC=CN&NR=118256090A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240628&DB=EPODOC&CC=CN&NR=118256090A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OTSUKA RIKUTO</creatorcontrib><creatorcontrib>YAMAGUCHI SOSUKE</creatorcontrib><creatorcontrib>TAKEUCHI JUNYA</creatorcontrib><title>Curable silicone composition</title><description>Provided is a curable silicone composition which is capable of providing a cured product having low RI and high hardness and which can be cured at a low temperature in a short period of time. The curable silicone composition according to the present invention comprises: (A-1) a resinous organopolysiloxane having an aryl group content of less than 0-10 mol% and having two or more alkenyl groups bonded to Si; (B-1) a resinous organohydrogenpolysiloxane having an aryl group content of 10 mol% or more and having two or more H bonds to Si; and (C) a hydrosilylation reaction catalyst, the amount of (A-2) a linear organopolysiloxane having two or more alkenyl groups bonded to Si in the composition being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition, and the amount of (A-3) a linear organopolysiloxane having two or more alkenyl groups bonded to Si being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition. (the total number of moles of H</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>METALLURGY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBxLi1KTMpJVSjOzMlMzs9LVUjOzy3IL84syczP42FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8c5-hoYWRqZmBpYGjsbEqAEAuzMkCw</recordid><startdate>20240628</startdate><enddate>20240628</enddate><creator>OTSUKA RIKUTO</creator><creator>YAMAGUCHI SOSUKE</creator><creator>TAKEUCHI JUNYA</creator><scope>EVB</scope></search><sort><creationdate>20240628</creationdate><title>Curable silicone composition</title><author>OTSUKA RIKUTO ; YAMAGUCHI SOSUKE ; TAKEUCHI JUNYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN118256090A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>METALLURGY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>OTSUKA RIKUTO</creatorcontrib><creatorcontrib>YAMAGUCHI SOSUKE</creatorcontrib><creatorcontrib>TAKEUCHI JUNYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OTSUKA RIKUTO</au><au>YAMAGUCHI SOSUKE</au><au>TAKEUCHI JUNYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Curable silicone composition</title><date>2024-06-28</date><risdate>2024</risdate><abstract>Provided is a curable silicone composition which is capable of providing a cured product having low RI and high hardness and which can be cured at a low temperature in a short period of time. The curable silicone composition according to the present invention comprises: (A-1) a resinous organopolysiloxane having an aryl group content of less than 0-10 mol% and having two or more alkenyl groups bonded to Si; (B-1) a resinous organohydrogenpolysiloxane having an aryl group content of 10 mol% or more and having two or more H bonds to Si; and (C) a hydrosilylation reaction catalyst, the amount of (A-2) a linear organopolysiloxane having two or more alkenyl groups bonded to Si in the composition being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition, and the amount of (A-3) a linear organopolysiloxane having two or more alkenyl groups bonded to Si being 0-3 mass% based on the total mass of all organopolysiloxane components in the composition. (the total number of moles of H</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORGANIC MACROMOLECULAR COMPOUNDS PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | Curable silicone composition |
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