Method for reducing expansion and shrinkage difference of base material for manufacturing multi-layer printed circuit board

The invention belongs to the technical field of circuit boards, and particularly relates to a method for reducing the expansion and shrinkage difference of a multi-layer printed circuit board manufacturing base material, a plurality of core layers and a press-fit heat conduction layer are included,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WU BOPING, SHEN JIAXIAO, HUANG SHIYU, LI JIUJUAN, YANG WENJUN, WANG SHOUXU, TANG HUIRONG, ZHOU GUOYUN
Format: Patent
Sprache:chi ; eng
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