Preparation method of radio frequency module passive integrated hybrid substrate

The invention discloses a preparation method of a radio frequency module passive integrated mixed substrate. The preparation method comprises the following steps: S1, forming an opening in a first substrate; s2, bonding a second substrate made of a material different from that of the first substrate...

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Bibliographische Detailangaben
Hauptverfasser: LIN LINA, ZHAO DAN, HAN LICHANG, TIAN YING, HU GUANGTAO, WEI MENG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a preparation method of a radio frequency module passive integrated mixed substrate. The preparation method comprises the following steps: S1, forming an opening in a first substrate; s2, bonding a second substrate made of a material different from that of the first substrate in the opening to obtain a makeup; s3, using temporary bonding glue to bond the makeup on the substrate; s4, the substrate is bonded to the UV film; s5, thinning the makeup to enable the first substrate and the second substrate to be coplanar; s6, carrying out ultraviolet irradiation to enable the UV film to be peptized, and removing the UV film; s7, carrying out de-bonding on the temporary bonding glue; s8, turning the makeup to the back side, and re-executing the steps S3-S7; and S9, forming a passive device and a transmission circuit on the second substrate in the makeup. According to the method, substrate materials with different performances required by different circuits can be realized on one substrate, the