Preparation method of radio frequency module passive integrated hybrid substrate

The invention discloses a preparation method of a radio frequency module passive integrated mixed substrate. The preparation method comprises the following steps: S1, forming an opening in a first substrate; s2, bonding a second substrate made of a material different from that of the first substrate...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIN LINA, ZHAO DAN, HAN LICHANG, TIAN YING, HU GUANGTAO, WEI MENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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