Packaging method of heterogeneous coplanar integrated chip
The invention relates to a method for packaging a heterogeneous coplanar integrated chip, which comprises the following steps of: bonding and fixing the front surfaces (bonding pad surfaces) of various bare chips made of different materials and manufactured by different processes on the front surfac...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a method for packaging a heterogeneous coplanar integrated chip, which comprises the following steps of: bonding and fixing the front surfaces (bonding pad surfaces) of various bare chips made of different materials and manufactured by different processes on the front surface of a glass substrate by using temporary bonding glue, arranging the chips according to a certain rule, pasting a blue film on the back surface of the glass substrate, and packaging the chips on the back surface of the glass substrate. Processing is carried out through a grinding machine or a thinning machine, technological parameters are optimized, coplanar thinning to the target thickness is achieved, and then discrete chips with the consistent thickness are obtained through de-bonding. Discrete chips are pasted on a high-heat-conduction shell, then coplanar ball planting is carried out, and the heterogeneous coplanar integrated chip is formed by welding the discrete chips at bonding pads corresponding to a mult |
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