Packaging method of heterogeneous coplanar integrated chip

The invention relates to a method for packaging a heterogeneous coplanar integrated chip, which comprises the following steps of: bonding and fixing the front surfaces (bonding pad surfaces) of various bare chips made of different materials and manufactured by different processes on the front surfac...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHANG PING, LIN LINA, HAN LICHANG, TIAN YING, WEI MENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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