Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
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| Format: | Elektronisch E-Book |
| Sprache: | English |
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2024
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| Ausgabe: | 1st ed. 2024 |
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| Online-Zugang: | DE-B768 DE-634 DE-1043 DE-1046 DE-Aug4 DE-1050 DE-573 DE-M347 DE-92 DE-898 DE-859 DE-860 DE-861 DE-863 DE-862 DE-523 DE-91 DE-706 DE-29 URL des Erstveröffentlichers |
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Datensatz im Suchindex
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| author | Lau, John H. |
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| discipline | Elektrotechnik Maschinenbau |
| doi_str_mv | 10.1007/978-981-97-2140-5 |
| edition | 1st ed. 2024 |
| format | Electronic eBook |
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| isbn | 9789819721405 |
| language | English |
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| physical | 1 Online-Ressource (XX, 501 p. 556 illus., 520 illus. in color) |
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| publishDate | 2024 |
| publishDateSearch | 2024 |
| publishDateSort | 2024 |
| publisher | Springer Nature Singapore Springer |
| record_format | marc |
| spellingShingle | Lau, John H. Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology Electronics and Microelectronics, Instrumentation Electronic Devices Laser Technology Optics and Photonics Electronics Solid state physics Lasers Optics |
| title | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology |
| title_auth | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology |
| title_exact_search | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology |
| title_full | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by John H. Lau |
| title_fullStr | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by John H. Lau |
| title_full_unstemmed | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology by John H. Lau |
| title_short | Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology |
| title_sort | flip chip hybrid bonding fan in and fan out technology |
| topic | Electronics and Microelectronics, Instrumentation Electronic Devices Laser Technology Optics and Photonics Electronics Solid state physics Lasers Optics |
| topic_facet | Electronics and Microelectronics, Instrumentation Electronic Devices Laser Technology Optics and Photonics Electronics Solid state physics Lasers Optics |
| url | https://doi.org/10.1007/978-981-97-2140-5 |
| work_keys_str_mv | AT laujohnh flipchiphybridbondingfaninandfanouttechnology |