Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
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Format: | Elektronisch E-Book |
Sprache: | English |
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Boston, MA
Elsevier
[2015]
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Schriftenreihe: | Woodhead Publishing series in electronic and optical materials
number 81 |
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100 | 1 | |a Wong, E- H. |e Verfasser |4 aut | |
245 | 1 | 0 | |a Robust design of microelectronics assemblies against mechanical schock, temperature and moisture |c E-H Wong, Y.-W Mai |
264 | 1 | |a Boston, MA |b Elsevier |c [2015] | |
264 | 4 | |c © 2015 | |
300 | |a 1 online resource (477 pages) |b illustrations (some color) | ||
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490 | 0 | |a Woodhead Publishing series in electronic and optical materials |v number 81 | |
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650 | 4 | |a Microelectronics |x Design | |
650 | 4 | |a Industrial design | |
650 | 4 | |a Robust control | |
700 | 1 | |a Mai, Y.-W. |4 aut | |
776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |a Wong, E- H. |t Robust design of microelectronics assemblies against mechanical schock, temperature and moisture |d Boston, MA : Elsevier, [2015] |k Woodhead Publishing series in electronic and optical materials ; number 81 |x 2050-1501 |z 9781845695286 |
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Datensatz im Suchindex
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any_adam_object | |
author | Wong, E- H. Mai, Y.-W |
author_facet | Wong, E- H. Mai, Y.-W |
author_role | aut aut |
author_sort | Wong, E- H. |
author_variant | e h w eh ehw y w m ywm |
building | Verbundindex |
bvnumber | BV045889053 |
collection | ZDB-30-PAD |
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dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381046 |
dewey-search | 621.381046 |
dewey-sort | 3621.381046 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
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id | DE-604.BV045889053 |
illustrated | Illustrated |
indexdate | 2024-07-10T08:29:30Z |
institution | BVB |
isbn | 9780857099112 |
issn | 2050-1501 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-031272089 |
oclc_num | 910159095 |
open_access_boolean | |
physical | 1 online resource (477 pages) illustrations (some color) |
psigel | ZDB-30-PAD |
publishDate | 2015 |
publishDateSearch | 2015 |
publishDateSort | 2015 |
publisher | Elsevier |
record_format | marc |
series2 | Woodhead Publishing series in electronic and optical materials |
spelling | Wong, E- H. Verfasser aut Robust design of microelectronics assemblies against mechanical schock, temperature and moisture E-H Wong, Y.-W Mai Boston, MA Elsevier [2015] © 2015 1 online resource (477 pages) illustrations (some color) txt rdacontent c rdamedia cr rdacarrier Woodhead Publishing series in electronic and optical materials number 81 Description based on print version record Microelectronics Design Industrial design Robust control Mai, Y.-W. aut Erscheint auch als Druck-Ausgabe Wong, E- H. Robust design of microelectronics assemblies against mechanical schock, temperature and moisture Boston, MA : Elsevier, [2015] Woodhead Publishing series in electronic and optical materials ; number 81 2050-1501 9781845695286 |
spellingShingle | Wong, E- H. Mai, Y.-W Robust design of microelectronics assemblies against mechanical schock, temperature and moisture Microelectronics Design Industrial design Robust control |
title | Robust design of microelectronics assemblies against mechanical schock, temperature and moisture |
title_auth | Robust design of microelectronics assemblies against mechanical schock, temperature and moisture |
title_exact_search | Robust design of microelectronics assemblies against mechanical schock, temperature and moisture |
title_full | Robust design of microelectronics assemblies against mechanical schock, temperature and moisture E-H Wong, Y.-W Mai |
title_fullStr | Robust design of microelectronics assemblies against mechanical schock, temperature and moisture E-H Wong, Y.-W Mai |
title_full_unstemmed | Robust design of microelectronics assemblies against mechanical schock, temperature and moisture E-H Wong, Y.-W Mai |
title_short | Robust design of microelectronics assemblies against mechanical schock, temperature and moisture |
title_sort | robust design of microelectronics assemblies against mechanical schock temperature and moisture |
topic | Microelectronics Design Industrial design Robust control |
topic_facet | Microelectronics Design Industrial design Robust control |
work_keys_str_mv | AT wongeh robustdesignofmicroelectronicsassembliesagainstmechanicalschocktemperatureandmoisture AT maiyw robustdesignofmicroelectronicsassembliesagainstmechanicalschocktemperatureandmoisture |