Robust design of microelectronics assemblies against mechanical schock, temperature and moisture

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Wong, E- H. (VerfasserIn), Mai, Y.-W (VerfasserIn)
Format: Elektronisch E-Book
Sprache:English
Veröffentlicht: Boston, MA Elsevier [2015]
Schriftenreihe:Woodhead Publishing series in electronic and optical materials number 81
Schlagworte:
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!

MARC

LEADER 00000nmm a2200000zcb4500
001 BV045889053
003 DE-604
005 00000000000000.0
007 cr|uuu---uuuuu
008 190521s2015 |||| o||u| ||||||eng d
020 |a 9780857099112  |c ebook  |9 978-0-85709-911-2 
035 |a (ZDB-30-PAD)EBC2056911 
035 |a (ZDB-89-EBL)EBL2056911 
035 |a (ZDB-38-EBR)ebr11058676 
035 |a (OCoLC)910159095 
035 |a (DE-599)BVBBV045889053 
040 |a DE-604  |b ger  |e rda 
041 0 |a eng 
082 0 |a 621.381046  |2 23 
100 1 |a Wong, E- H.  |e Verfasser  |4 aut 
245 1 0 |a Robust design of microelectronics assemblies against mechanical schock, temperature and moisture  |c E-H Wong, Y.-W Mai 
264 1 |a Boston, MA  |b Elsevier  |c [2015] 
264 4 |c © 2015 
300 |a 1 online resource (477 pages)  |b illustrations (some color) 
336 |b txt  |2 rdacontent 
337 |b c  |2 rdamedia 
338 |b cr  |2 rdacarrier 
490 0 |a Woodhead Publishing series in electronic and optical materials  |v number 81 
500 |a Description based on print version record 
650 4 |a Microelectronics  |x Design 
650 4 |a Industrial design 
650 4 |a Robust control 
700 1 |a Mai, Y.-W.  |4 aut 
776 0 8 |i Erscheint auch als  |n Druck-Ausgabe  |a Wong, E- H.  |t Robust design of microelectronics assemblies against mechanical schock, temperature and moisture  |d Boston, MA : Elsevier, [2015]  |k Woodhead Publishing series in electronic and optical materials ; number 81  |x 2050-1501  |z 9781845695286 
912 |a ZDB-30-PAD 
999 |a oai:aleph.bib-bvb.de:BVB01-031272089 

Datensatz im Suchindex

_version_ 1804180043992137728
any_adam_object
author Wong, E- H.
Mai, Y.-W
author_facet Wong, E- H.
Mai, Y.-W
author_role aut
aut
author_sort Wong, E- H.
author_variant e h w eh ehw
y w m ywm
building Verbundindex
bvnumber BV045889053
collection ZDB-30-PAD
ctrlnum (ZDB-30-PAD)EBC2056911
(ZDB-89-EBL)EBL2056911
(ZDB-38-EBR)ebr11058676
(OCoLC)910159095
(DE-599)BVBBV045889053
dewey-full 621.381046
dewey-hundreds 600 - Technology (Applied sciences)
dewey-ones 621 - Applied physics
dewey-raw 621.381046
dewey-search 621.381046
dewey-sort 3621.381046
dewey-tens 620 - Engineering and allied operations
discipline Elektrotechnik / Elektronik / Nachrichtentechnik
format Electronic
eBook
fullrecord <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01579nmm a2200397zcb4500</leader><controlfield tag="001">BV045889053</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">190521s2015 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780857099112</subfield><subfield code="c">ebook</subfield><subfield code="9">978-0-85709-911-2</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-30-PAD)EBC2056911</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-89-EBL)EBL2056911</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-38-EBR)ebr11058676</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)910159095</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV045889053</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381046</subfield><subfield code="2">23</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Wong, E- H.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Robust design of microelectronics assemblies against mechanical schock, temperature and moisture</subfield><subfield code="c">E-H Wong, Y.-W Mai</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boston, MA</subfield><subfield code="b">Elsevier</subfield><subfield code="c">[2015]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2015</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (477 pages)</subfield><subfield code="b">illustrations (some color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Woodhead Publishing series in electronic and optical materials</subfield><subfield code="v">number 81</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Description based on print version record</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield><subfield code="x">Design</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Industrial design</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Robust control</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Mai, Y.-W.</subfield><subfield code="4">aut</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="a">Wong, E- H.</subfield><subfield code="t">Robust design of microelectronics assemblies against mechanical schock, temperature and moisture</subfield><subfield code="d">Boston, MA : Elsevier, [2015]</subfield><subfield code="k">Woodhead Publishing series in electronic and optical materials ; number 81</subfield><subfield code="x">2050-1501</subfield><subfield code="z">9781845695286</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-30-PAD</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-031272089</subfield></datafield></record></collection>
id DE-604.BV045889053
illustrated Illustrated
indexdate 2024-07-10T08:29:30Z
institution BVB
isbn 9780857099112
issn 2050-1501
language English
oai_aleph_id oai:aleph.bib-bvb.de:BVB01-031272089
oclc_num 910159095
open_access_boolean
physical 1 online resource (477 pages) illustrations (some color)
psigel ZDB-30-PAD
publishDate 2015
publishDateSearch 2015
publishDateSort 2015
publisher Elsevier
record_format marc
series2 Woodhead Publishing series in electronic and optical materials
spelling Wong, E- H. Verfasser aut
Robust design of microelectronics assemblies against mechanical schock, temperature and moisture E-H Wong, Y.-W Mai
Boston, MA Elsevier [2015]
© 2015
1 online resource (477 pages) illustrations (some color)
txt rdacontent
c rdamedia
cr rdacarrier
Woodhead Publishing series in electronic and optical materials number 81
Description based on print version record
Microelectronics Design
Industrial design
Robust control
Mai, Y.-W. aut
Erscheint auch als Druck-Ausgabe Wong, E- H. Robust design of microelectronics assemblies against mechanical schock, temperature and moisture Boston, MA : Elsevier, [2015] Woodhead Publishing series in electronic and optical materials ; number 81 2050-1501 9781845695286
spellingShingle Wong, E- H.
Mai, Y.-W
Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
Microelectronics Design
Industrial design
Robust control
title Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
title_auth Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
title_exact_search Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
title_full Robust design of microelectronics assemblies against mechanical schock, temperature and moisture E-H Wong, Y.-W Mai
title_fullStr Robust design of microelectronics assemblies against mechanical schock, temperature and moisture E-H Wong, Y.-W Mai
title_full_unstemmed Robust design of microelectronics assemblies against mechanical schock, temperature and moisture E-H Wong, Y.-W Mai
title_short Robust design of microelectronics assemblies against mechanical schock, temperature and moisture
title_sort robust design of microelectronics assemblies against mechanical schock temperature and moisture
topic Microelectronics Design
Industrial design
Robust control
topic_facet Microelectronics Design
Industrial design
Robust control
work_keys_str_mv AT wongeh robustdesignofmicroelectronicsassembliesagainstmechanicalschocktemperatureandmoisture
AT maiyw robustdesignofmicroelectronicsassembliesagainstmechanicalschocktemperatureandmoisture