Physical Design for Multichip Modules

Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of M...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sriram, M. (VerfasserIn), Kang, S. M. (VerfasserIn)
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	Boston, MA Springer US 1994
Schriftenreihe:	The Springer International Series in Engineering and Computer Science 267
Schlagworte:	Engineering Circuits and Systems Electrical Engineering Computer-Aided Engineering (CAD, CAE) and Design Computer-aided engineering Electrical engineering Electronic circuits
Online-Zugang:	DE-634 URL des Erstveröffentlichers
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